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SK Hynix, TSMC team on next generation memory

SK Hynix has unveiled a partnership with Taiwan Semiconductor Manufacturing Company (TSMC) to jointly produce the latest generation of high-bandwidth memory (HBM), with mass production of the sixth-generation HBM4 technology expected to begin in 2026.

In a statement, SK Hynix claimed that the collaboration between the world leaders in AI memory and logic foundry will drive innovations in HBM technology, with the collaboration improving performance through trilateral collaboration between product design, foundry and memory supplier.

The company said it will move from using proprietary technology to make base chips for the current HBM3E chips to TSMC’s advanced logic process for the base chip of HBM4, allowing it to pack additional functionality into the limited space. The technology will enable SK Hynix to produce tailor-made HBM that meets a wide range of customer demands for performance and energy efficiency.

As part of an agreement, the two will also work together to optimize the integration of SK Hynix’s HBM and TSMC’s chip-on-wafer-on-substrate technology.

Kevin Zhang, deputy co-COO of TSMC, noted that the two companies have built a strong partnership over the years, working together to integrate the most advanced logic and state-of-the-art HBM to deliver leading AI to deliver chips.